Semiconductor device

ABSTRACT

According to one embodiment, a semiconductor device includes first and second electrodes, first, second, and third semiconductor regions, an insulating part, a conductive part, and a gate electrode. The first semiconductor region is provided on the first electrode and is electrically connected to the first electrode. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The insulating part is provided on the first electrode. The conductive part is provided in the insulating part and is arranged with the first semiconductor region. The gate electrode is provided in the insulating part. The gate electrode is positioned above the conductive part and is arranged with the second semiconductor region. The second electrode is provided on the third semiconductor region and the insulating part, and is electrically connected to the third semiconductor region.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2020-129272, filed on Jul. 30, 2020; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor device.

BACKGROUND

Reduction in the on-resistance of semiconductor devices such as ametal-oxide-semiconductor field effect transistor (MOSFET) has beendesired.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective cross-sectional view illustrating asemiconductor device according to an embodiment;

FIGS. 2A and 2B are cross-sectional views illustrating a productionprocess of the semiconductor device according to the embodiment;

FIGS. 3A and 3B are cross-sectional views illustrating a productionprocess of the semiconductor device according to the embodiment;

FIG. 4 is a perspective cross-sectional view illustrating asemiconductor device according to a modification;

FIG. 5 is a perspective cross-sectional view illustrating asemiconductor device according to a modification;

FIG. 6 is a perspective cross-sectional view illustrating asemiconductor device according to a modification;

FIG. 7 is a perspective cross-sectional view illustrating asemiconductor device according to a modification;

FIG. 8 is a perspective cross-sectional view illustrating semiconductordevices according to a modification;

FIGS. 9A to 9D are cross-sectional views illustrating a productionprocess of the semiconductor device illustrated in FIG. 8;

FIGS. 10A to 10D are cross-sectional views illustrating a productionprocess of the semiconductor device illustrated in FIG. 8;

FIGS. 11A and 11B are cross-sectional views illustrating a productionprocess of the semiconductor device illustrated in FIG. 8;

FIG. 12 is a perspective cross-sectional view illustrating asemiconductor device according to a modification;

FIG. 13 is a perspective cross-sectional view illustrating asemiconductor device according to a modification; and

FIG. 14 is a perspective cross-sectional view illustrating asemiconductor device according to a modification.

DETAILED DESCRIPTION

According to one embodiment, a semiconductor device includes a firstelectrode, a first semiconductor region of a first conductivity type, asecond semiconductor region of a second conductive type, a thirdsemiconductor region of the first conductive type, an insulating part, aconductive part, a gate electrode, and a second electrode. The firstsemiconductor region is provided on the first electrode and iselectrically connected to the first electrode. The second semiconductorregion is provided on the first semiconductor region. The thirdsemiconductor region is provided on the second semiconductor region. Theinsulating part is provided on the first electrode and is in directcontact with the first electrode. The conductive part is provided in theinsulating part and is arranged in a second direction that crosses afirst direction directed from the first electrode to the firstsemiconductor region, with the first semiconductor region. The gateelectrode is provided in the insulating part. The gate electrode ispositioned above the conductive part and is arranged in the seconddirection with the second semiconductor region. The second electrode isprovided on the third semiconductor region and the insulating part, andis electrically connected to the third semiconductor region.

Various embodiments are described below with reference to theaccompanying drawings.

The drawings are schematic and conceptual; and the relationships betweenthe thickness and width of portions, the proportions of sizes amongportions, etc., are not necessarily the same as the actual values. Thedimensions and proportions may be illustrated differently amongdrawings, even for identical portions.

In the specification and drawings, components similar to those describedpreviously or illustrated in an antecedent drawing are marked with likereference numerals, and a detailed description is omitted asappropriate.

In the following description and drawings, the notations n⁺, n⁻ and p⁺,p represent the relative highs and lows of each impurity concentration.That is, the notation with “+” indicates that the impurity concentrationis relatively higher than the notation without either “+” or “−”, andthe notation with “−” indicates that the impurity concentration isrelatively lower than the notation not marked with either “+” or “−”.When a region contains both p-type impurities and n-type impurities,these notations represent the relative high and low of the net impurityconcentration after the impurities have compensated for each other.

FIG. 1 is a perspective cross-sectional view illustrating asemiconductor device according to an embodiment.

A semiconductor device 100 according to an embodiment is a MOSFET. Asillustrated in FIG. 1, the semiconductor device 100 according to anembodiment includes an n⁻-type (first conductivity type) drift region 1(first semiconductor region), a p-type (second conductivity type) baseregion 2 (second semiconductor region), an n⁺-type source region 3(third semiconductor region), an n⁺-type drain region 4 (fourthsemiconductor region), a p⁺-type contact region 5, an insulating part10, a conductive part 11, a gate electrode 12, a drain electrode 21(first electrode), and a source electrode 22 (second electrode).

An XYZ orthogonal coordinate system as employed in the description ofthe embodiment. A direction directed from the drain electrode 21 to then⁻-type drift region 1 is Z-direction (first direction). Two directionsthat are perpendicular to Z-direction and orthogonal to each other areX-direction (second direction) and Y-direction (third direction).Further, for description, a direction directed from the drain electrode21 to the n⁻-type drift region 1 is referred to as “upper” and anopposite direction thereof is referred to as “lower”. These directionsare based on the relative positional relationship between the drainelectrode 21 and the n⁻-type drift region 1, and thus have norelationship with the direction of gravity.

The drain electrode 21 is provided on the lower surface of thesemiconductor device 100. The n⁺-type drain region 4 is provided on thedrain electrode 21 and is electrically connected to the drain electrode21. The n⁻-type drift region 1 is provided on the n⁺-type drain region4. The n⁻-type drift region 1 is electrically connected to the drainelectrode 21 via the n⁺-type drain region 4. The n-type impurity densityin the n⁻-type drift region 1 is lower than the n-type impurity densityin the n⁺-type drain region 4.

The p-type base region 2 is provided on the n⁻-type drift region 1. Then⁺-type source region 3 and the p⁺-type contact region 5 are provided onthe p-type base region 2. The p-type impurity density in the p⁺-typecontact region 5 is higher than the p-type impurity density in thep-type base region 2.

The insulating part 10 is provided on the drain electrode 21 and is indirect contact with the drain electrode 21. The insulating part 10 isarranged in X-direction with the n⁻-type drift region 1, the p-type baseregion 2, the n⁺-type source region 3, the n⁺-type drain region 4, andthe p⁺-type contact region 5. For example, the insulating part 10 is indirect contact with the n⁻-type drift region 1, the p-type base region2, the n⁺-type source region 3, and the n⁺-type drain region 4.

The conductive part 11 and the gate electrode 12 are provided in theinsulating part 10. The conductive part 11 is arranged in X-directionwith the n⁻-type drift region 1. The gate electrode 12 is provided abovethe conductive part 11. The gate electrode 12 is arranged in X-directionwith the p-type base region 2. A part of the insulating part 10 isprovided as a gate insulating layer between the p-type base region 2 andthe gate electrode 12. The source electrode 22 is provided on then⁺-type source region 3, the p⁺-type contact region 5, and theinsulating part 10, and is electrically connected to the n⁺-type sourceregion 3 and the p⁺-type contact region 5.

For example, a plurality of n⁻-type drift regions 1, p-type base regions2, n⁺-type source regions 3, n⁺-type drain regions 4, p⁺-type contactregions 5, insulating parts 10, conductive parts 11, and gate electrodes12 are provided in X-direction. A pair of n⁺-type source regions 3 whichare separated from each other in X-direction is provided on each p-typebase region 2. The p⁺-type contact region 5 is positioned between thepair of n⁺-type source regions 3. The n⁻-type drift region 1, p-typebase region 2, n⁺-type source region 3, n⁺-type drain region 4, p⁺-typecontact region 5, insulating part 10, and conductive part 11, and gateelectrode 12 each extend in Y-direction.

For example, the conductive part 11 is separated from the gate electrode12 in Z-direction. The conductive part 11 is electrically separated fromthe gate electrode 12. The end portion of the conductive part 11 inY-direction extends upward and is electrically connected to the sourceelectrode 22. Alternatively, the conductive part 11 may extend inZ-direction to come into contact with the gate electrode 12 and iselectrically connected to the gate electrode 12.

Operations of the semiconductor device 100 will be described.

A voltage higher than a threshold is applied to the gate electrode 12 ina state in which a voltage positive with respect to the source electrode22 is applied to the drain electrode 21. A channel (inversion layer) isformed in the p-type base region 2. Electrons flow into the drainelectrode 21 via the channel and the n⁻-type drift region 1. This bringsthe semiconductor device 100 into an on-state. Thereafter, when thevoltage applied to the gate electrode 12 becomes lower than thethreshold, the channel in the p-type base region 2 disappears, so thatthe semiconductor device 100 is brought into an off-state.

When the semiconductor device 100 is switched to the off-state, thepositive voltage applied to the drain electrode 21 increases relative tothe source electrode 22. A depletion layer extends from a p-n junctionbetween the p-type base region 2 and the n⁻-type drift region 1 to then⁻-type drift region 1. Further, a depletion layer formed due to thepotential difference between the drain electrode 21 and the conductivepart 11 extend from the interface between the insulating part 10 and then⁻-type drift region 1 to the n⁻-type drift region 1. The breakdownvoltage of the semiconductor device 100 can be increased by extension ofthe latter depletion layer. Alternatively, the n-type impurity densityin the n⁻-type drift region 1 is increased while the breakdown voltageof the semiconductor device 100 is maintained, whereby the on-resistanceof the semiconductor device 100 can be reduced.

An example of materials for constituent elements of the semiconductordevice 100 will be described.

The n⁻-type drift region 1, the p-type base region 2, the n⁺-type sourceregion 3, the n⁺-type drain region 4, and the p⁺-type contact region 5include, as a semiconductor material, silicon, silicon carbide, galliumnitride, gallium oxide, or gallium arsenide. In a case where silicon isused as a semiconductor material, arsenic, phosphorus, or antimony canbe used as the n-type impurity. Boron may be used as the p-typeimpurity. The conductive part 11 and the gate electrode 12 include aconductive material such as polysilicon. The insulating part 10 includesan insulating material such as silicon oxide. The drain electrode 21 andthe source electrode 22 include a metal such as copper and aluminum.

FIGS. 2A and 2B, and FIGS. 3A and 3B are cross-sectional viewsillustrating a production process of the semiconductor device accordingto the embodiment.

An n⁻-type semiconductor substrate 1 a is prepared. As illustrated inFIG. 2A, the insulating part 10, the conductive part 11, the gateelectrode 12, the p-type base region 2, the n⁺-type source region 3, thep⁺-type contact region 5, and the source electrode 22 are formed in thesemiconductor substrate 1 a by a known method. For example, theseelements are formed by formation of an opening in the upper surface ofthe semiconductor substrate 1 a, embedding of the insulating materialand conductive material into the opening, and implantation of ions intothe upper surface of the semiconductor substrate 1 a.

As illustrated in FIG. 2B, a support member 30 is bonded to the uppersurface of the source electrode 22 with an adhesive 31. The supportmember 30 is, for example, a glass plate.

The lower surface of the semiconductor substrate 1 a is ground. At thattime, the semiconductor substrate 1 a is ground so that the insulatingpart 10 is not exposed. As illustrated in FIG. 3A, the lower surface ofthe semiconductor substrate 1 a is allowed to be recessed throughchemical-mechanical polishing (CMP) or wet etching to expose theinsulating part 10. The semiconductor substrate 1 a remaining betweenthe insulating parts 10 corresponds to the n⁻-type drift region 1.

The n-type impurity is ion-implanted into the lower surface of then⁻-type drift region 1 between the insulating parts 10 to form then⁺-type drain region 4. As illustrated in FIG. 3B, the drain electrode21 is formed under the n⁺-type drain region 4 and the insulating part 10by sputtering. The support member 30 and the adhesive 31 are separated.Thus, the semiconductor device 100 according to an embodiment isproduced.

Effects of the embodiment will be described.

In the semiconductor device 100, the drain electrode 21 is in directcontact with the insulating part 10. In other words, a semiconductorregion is not provided between the drain electrode 21 and the insulatingpart 10. According to an embodiment, the distance between the drainelectrode 21 and the p-type base region 2 can be shortened compared to acase where a semiconductor region is provided between the drainelectrode 21 and the insulating part 10. When the semiconductor device100 is in an on-state, the temperature of the p-type base region 2 wherethe channel is formed is more easily increased than the other portions.By shortening the distance between the drain electrode 21 and the p-typebase region 2, heat generated in the p-type base region 2 is easilyreleased from the drain electrode 21. Increase in the temperature in thesemiconductor device 100 is suppressed. For example, increase in theelectrical resistance of the n⁻-type drift region 1 due to temperatureincrease is suppressed, thus reducing the on-resistance of thesemiconductor device 100.

Also, according to an embodiment, the path of the current flowing inZ-direction is shorter than a case where a semiconductor region isprovided between the drain electrode 21 and the insulating part 10.Thereby, the on-resistance of the semiconductor device 100 can befurther reduced.

In the formation of the insulating part 10, the conductive part 11, andthe gate electrode 12, compressive stress is generated in theseelements. Such compressive stress causes the semiconductor substrate isto be warped. In the semiconductor device 100, the drain electrode 21and the source electrode 22 are respectively provided on the top andbottom of the insulating part 10. By providing electrodes on the top andbottom of the insulating part 10, the difference between the stressgenerated in the upper portion of the insulating part 10 and the stressgenerated in the lower portion of the insulating part 10 can be reducedcompared to a case where a semiconductor region is provided between thedrain electrode 21 and the insulating part 10. As a result, the warpageof the semiconductor device 100 can be reduced. For example, it ispossible to reduce a possibility that the semiconductor device 100 isdamaged due to warpage. When the semiconductor device 100 is conveyed byusing the support member 30, the capacity to hold the support member 30by the conveying device is improved, thus reducing a possibility ofoccurrence of falling or positional shift of the support member 30, andthe like.

The semiconductor device 100 preferably includes the n⁺-type drainregion 4. By providing the n⁺-type drain region 4, the electricalresistance between the drain electrode 21 and the n⁻-type drift region 1can be reduced. For example, the on-resistance of the semiconductordevice 100 can be reduced. Also, by providing the n⁺-type drain region 4in X-direction at a position aligned with the lower end of theinsulating part 10, the electric field intensity in the vicinity of thelower end of the n⁻-type drift region 1 is increased. Thereby, thebreakdown voltage of the semiconductor device 100 can be improved.

As an example, in a case where a breakdown voltage of 100 V is obtainedbetween the drain electrode 21 and the source electrode 22, the size andimpurity density of each constituent element of the semiconductor device100 is preferably the following values from the perspective of theon-resistance and the breakdown voltage. The length of the insulatingpart 10 in X-direction is longer than 1.0 μm and less than 1.5 μm. Thelength of the n⁻-type drift region 1 in X-direction is longer than 0.4μm and less than 0.6 μm. The length of the n⁻-type drift region 1 inZ-direction is longer than 3.0 μm and less than 5.0 μm. The length ofthe p-type base region 2 in Z-direction is longer than 0.1 μm and lessthan 0.3 μm. The n-type impurity density in the n⁻-type drift region 1is greater than 2.0×10¹⁶ atoms/cm³ and less than 2.0×10¹⁷ atoms/cm³. Thep-type impurity density in the p-type base region 2 is greater than3.0×10¹⁷ atoms/cm³ and less than 1.0×10¹⁸ atoms/cm³. The density of then⁺-type source region 3, the n⁺-type drain region 4, and the p⁺-typecontact region 5 is set such that these regions can be in ohmic contactwith the drain electrode 21 and the source electrode 22.

(Modification)

FIGS. 4 to 8 are perspective cross-sectional views illustratingsemiconductor devices according to modifications.

As a semiconductor device 110 illustrated in FIG. 4, a part of theinsulating part 10 may be arranged in X-direction with a part of thedrain electrode 21. For example, the drain electrode 21 has protrusionsprovided between the lower ends of the insulating part 10 inX-direction. A plurality of protrusions and a plurality of lower ends ofthe insulating part 10 are alternately provided in X-direction.

The lower end of the insulating part 10 extends into the drain electrode21 and arranged in X-direction with a part of the drain electrode 21.Thereby, the electric field intensity in the vicinity of the lower endof the n⁻-type drift region 1 is further increased. As a result, thebreakdown voltage of the semiconductor device 110 can be improved.

As a semiconductor device 120 illustrated in FIG. 5, the drain electrode21 may include a first metal layer 21 a and a first conductive layer 21b. The first conductive layer 21 b is provided between the first metallayer 21 a and the n⁺-type drain region 4, and between the first metallayer 21 a and the insulating part 10. For example, the first conductivelayer 21 b is in contact with the n⁺-type drain region 4 and theinsulating part 10.

The first metal layer 21 a includes a first metal. The first metal is atleast one selected from the group consisting of aluminum, nickel,copper, silver, vanadium, and chromium. The first conductive layer 21 bincludes a second metal. The second metal is at least one selected fromthe group consisting of molybdenum, tungsten, cobalt, nickel, titanium,and aluminum. For example, the first metal is different from the secondmetal. The first metal and the second metal may be the same, and thecomposition of the first metal and the composition of the second metalmay be different from each other. At least a part of the firstconductive layer 21 b may be silicide. Silicide includes silicon and thesecond metal. By providing the first conductive layer 21 b, diffusion ofthe semiconductor material included in the n⁻-type drift region 1 andthe n⁺-type drain region 4 can be suppressed.

The source electrode 22 may include a second metal layer 22 a and asecond conductive layer 22 b. The second conductive layer 22 b isprovided between the insulating part 10 and the second metal layer 22 a,between the n⁺-type source region 3 and the second metal layer 22 a, andbetween the p⁺-type contact region 5 and the second metal layer 22 a.The second metal layer 22 a is provided on the second conductive layer22 b. For example, the second conductive layer 22 b is in contact withthe n⁺-type source region 3, the p⁺-type contact region 5, and theinsulating part 10.

The second metal layer 22 a includes a third metal. The third metal isat least one selected from the group consisting of aluminum, nickel,copper, silver, vanadium, and chromium. The second conductive layer 22 bincludes a fourth metal. The fourth metal is at least one selected fromthe group consisting of molybdenum, tungsten, cobalt, nickel, titanium,and aluminum. The third metal is different from the fourth metal. Thethird metal and the fourth metal may be the same, and the composition ofthe third metal and the composition of the fourth metal may be differentfrom each other. At least a part of the second conductive layer 22 b maybe silicide. Silicide includes silicon and the fourth metal. Byproviding the second conductive layer 22 b, diffusion of thesemiconductor material included in the n⁺-type source region 3 and thep⁺-type contact region 5 can be suppressed.

As a semiconductor device 130 illustrated in FIG. 6, a part of the firstconductive layer 21 b may be arranged in X-direction with the insulatingpart 10. For example, the first conductive layer 21 b has protrusionseach provided between the lower ends of the insulating part 10 inX-direction. A plurality of protrusions and a plurality of lower ends ofthe insulating part 10 are alternately provided in X-direction.

According to the semiconductor device 130, the electric field intensityin the vicinity of the lower end of the n⁻-type drift region 1 isfurther increased as in the semiconductor device 110. As a result, thebreakdown voltage of the semiconductor device 130 can be improved.

As a semiconductor device 140 illustrated in FIG. 7, the width of theconductive part 11 (length in X-direction) may vary in Z-direction. Thewidth of the lower portion of the conductive part 11 is narrower thanthe upper portion of the conductive part 11. The width of the conductivepart 11 is decreased downwardly. For example, as illustrated in FIG. 7,the side surface of the conductive part 11 is inclined with respect toZ-direction, and the width of the conductive part 11 is graduallydecreased downwardly. The conductive part 11 may have a stepped sidesurface, and the width of the conductive part 11 may be graduallydecreased downwardly. The number of steps in the side surface of theconductive part 11 is discretionary. The number of steps is preferablylarge.

According to the structure of the conductive part 11, the electric fieldintensity of the n⁻-type drift region 1 in a position that is arrangedin X-direction with the top portion of the conductive part 11 can beincreased compared to the semiconductor device 100. As a result, thebreakdown voltage of the semiconductor device 140 can be improved.Alternatively, the length of the n⁻-type drift region 1 in Z-directionand the length of the conductive part 11 in Z-direction can be shortenedaccording to increase in the electric field intensity in the n⁻-typedrift region 1. Thereby, the on-resistance of the semiconductor device140 can be reduced while decrease in the breakdown voltage issuppressed.

As a semiconductor device 150 illustrated in FIG. 8, the insulating part10 may include an insulating portion 10 a and a gap G. The gap G isprovided between the drain electrode 21 and the conductive part 11,between the n⁺-type drain region 4 and the conductive part 11, andbetween the n⁻-type drift region 1 and the conductive part 11. Theinsulating portion 10 a is provided above the gap G and the conductivepart 11. The lower surface of the insulating portion 10 a is positionedlower than the upper surface of the conductive part 11.

Inclusion of the gap G in the insulating part 10 allows the relativepermittivity in the insulating part 10 to be reduced. Thereby, thedepletion layer easily extends in the n⁻-type drift region 1, and thusthe breakdown voltage of the semiconductor device 150 is improved.Alternatively, the thickness of the insulating part 10 between then⁻-type drift region 1 and the conductive part 11 can be reduced whilethe breakdown voltage is maintained. For example, the size of thesemiconductor device 150 can be reduced. Alternatively, the numbers ofthe insulating part 10 and n⁻-type drift region 1 per unit area areincreased by a thickness corresponding to the reduction in thickness ofthe insulating part 10. Thus, the on-resistance of the semiconductordevice 150 can be reduced while increase in size of the semiconductordevice 150 is suppressed.

As an example, in the semiconductor device 150, in a case where abreakdown voltage of 100 V is obtained between the drain electrode 21and the source electrode 22, the length of the insulating part 10 inX-direction is longer than 0.3 μm and less than 1.0 μm.

FIGS. 9A to 11B are cross-sectional views illustrating a productionprocess of the semiconductor device illustrated in FIG. 8.

In FIGS. 9A to 11B the left side represents a production process in apart of the X-Z cross-section illustrated in FIG. 8. The right siderepresents a production process in a part of the X-Z cross-sectionincluding the A1-A2 line illustrated in FIG. 8.

First, an n⁻-type semiconductor substrate 1 a is prepared. A pluralityof trenches T extending in Y-direction are formed on the upper surfaceof the semiconductor substrate 1 a. For example, as illustrated in FIG.9A, an insulating layer IL1 is formed along the inner wall of the trenchT and the upper surface of the semiconductor substrate 1 a by CVD.

A conductive layer is formed on the insulating layer IL1 by chemicalvapor deposition (CVD). The upper surface of this conductive layer isallowed to be recessed by isotropic chemical dry etching (CDE),anisotropic reactive ion etching (RIE), or isotropic wet etching, thusforming a conductive part provided in the trench T. The upper surface ofthe conductive part is selectively recessed by patterning usinglithography. In this way, as illustrated in FIG. 9B, a first conductiveportion 11 a and a second conductive portion 11 b having differentlengths in Z-direction are formed. In the subsequent process, the secondconductive portion 11 b is provided in a portion electrically connectedto the source electrode 22. The first conductive portion 11 a isprovided in other portions.

The upper surface of the insulating layer IL1 is allowed to be recessedby CDE or wet etching to a position at which the upper end of theinsulating layer IL1 is positioned lower than the upper surface of thefirst conductive portion 11 a and the second conductive portion 11 b. Asillustrated in FIG. 9C, an insulating layer IL2 for embedding the trenchT is formed on the insulating layer IL1 the first conductive portion 11a, and the second conductive portion lib by CVD. At that time, aninsulating material used for formation of the insulating layer IL2 isselected so that the insulating layer IL1 can be selectively etched inthe subsequent process. As an example, in a case where the insulatinglayer IL1 includes silicon nitride, silicon oxide can be used for theinsulating layer IL2.

A part of the insulating layer IL2 is removed by CDE or wet etching toexpose the upper surface of the semiconductor substrate 1 a and a partof the inner wall of the trench T. At that time, the insulating layerIL1 is not substantially removed. On the upper part of the secondconductive portion 11 b, the insulating layer IL2 is entirely removed.As illustrated in FIG. 9D, an insulating layer IL3 is formed. A part ofthe insulating layer IL3 finally remains as a gate insulating layer. Theinsulating layer IL3 is preferably formed by thermal oxidation. Theinsulating layer IL3 may be formed by depositing silicon oxide by CVDand preforming annealing at high temperature. On the upper part of thefirst conductive portion 11 a, the insulating layer IL3 is formed alongthe upper surface of the semiconductor substrate 1 a and the inner wallof the trench T. On the upper part of the second conductive portion 11b, the upper end of the trench T is embedded with the insulating layerIL3.

A conductive layer is formed on the insulating layers IL2 and IL3 byCVD. The upper surface of this conductive layer is allowed to berecessed, and thus the gate electrode 12 is formed on the firstconductive portion 11 a by CDE or wet etching as illustrated in FIG.10A. A part of the insulating layer IL3 is removed by CDE or wet etchingto expose the upper surface of the insulating layer IL1 provided aroundthe second conductive portion lib as illustrated in FIG. 10B. A part ofthe insulating layer IL3 remains between the semiconductor substrate 1 aand the gate electrode 12.

A chemical solution is introduced into an inside of the trench T whilethe insulating layer IL1 around the second conductive portion 11 b isremoved by wet etching. Thereby, the insulating layer IL1 around thefirst conductive portion 11 a is also removed, and thus a gap betweenthe semiconductor substrate 1 a and the first conductive portion 11 a,and between the semiconductor substrate 1 a and the second conductiveportion 11 b is formed as illustrated in FIG. 10C. In a case where theinsulating layer IL1 includes silicon nitride and the insulating layerIL2 includes silicon oxide, the insulating layer IL1 can be removedselectively with respect to the insulating layer IL2 by wet etchingusing phosphoric acid.

An insulating layer IL4 is formed on the upper surface of thesemiconductor substrate 1 a by CVD. As illustrated in FIG. 10D, the gapis closed by the insulating layer IL4. At that time, in the subsequentprocess, to suppress warpage of the substrate and damage of theinsulating layer IL4 due to thermal expansion of gas in this gap, theinsulating layer IL4 may be formed in a reduced-pressure atmosphere. Inthis case, the air pressure of the gap is less than the atmosphericpressure.

The upper surface of the insulating layer IL4 is allowed to be recessedby CMP to expose the upper surface of the semiconductor substrate 1 a.The p-type impurity and the n-type impurity are sequentiallyion-implanted into the upper surface of the exposed semiconductorsubstrate 1 a to form the p-type base region 2, the n⁺-type sourceregion 3, and the p⁺-type contact region 5 as illustrated in FIG. 11A.

A part of the insulating layer IL4 is removed by RIE to expose the upperend of the second conductive portion 11 b. As illustrated in FIG. 11B,the source electrode 22 is formed on the n⁺-type source region 3, thep⁺-type contact region 5, and the insulating layer IL4 by sputtering.The second conductive portion 11 b is electrically connected to thesource electrode 22. Thereafter, the semiconductor device 150 isproduced by carrying out the processes illustrated in FIGS. 2A to 3B.

FIGS. 12 to 14 are perspective cross-sectional views illustratingsemiconductor devices according to modifications.

In a semiconductor device 160 illustrated in FIG. 12, the insulatingpart 10 includes an insulating portion 10 a, an insulating portion 10 b,and a gap G.

The insulating portion 10 b is provided along the drain electrode 21,the n⁺-type drain region 4, and the n⁻-type drift region 1. The gap G isprovided between the insulating portion 10 b and the conductive part 11.The insulating portion 10 a is provided above the insulating portion 10b, the gap G, and the conductive part 11. The gate electrode 12 isprovided in the upper portion of the insulating portion 10 a. The lowersurface of the insulating portion 10 a exposed to the gap G ispositioned lower than the upper surface of the conductive part 11.

The insulating portion 10 b is formed by, for example, subjecting thesemiconductor substrate 1 a to thermal oxidation after the processillustrated in FIG. 10C. By providing the insulating portion 10 b, it ispossible to prevent the surface of the n⁺-type drain region 4 and then⁻-type drift region 1 from being exposed to the gap G. For example, bycovering the surface of the n⁻-type drift region 1 with the insulatingportion 10 b, it is possible to prevent leak current from flowing intothe surface of the n⁻-type drift region 1.

In a semiconductor device 170 illustrated in FIG. 13, the insulatingpart 10 includes insulating portions 10 a and 10 c. The insulatingportion 10 c is provided between the drain electrode 21 and theconductive part 11, between the n⁺-type drain region 4 and theconductive part 11, and between the n⁻-type drift region 1 and theconductive part 11. The insulating portion 10 a is provided on theinsulating portion 10 c and the conductive part 11.

The relative permittivity in the insulating portion 10 c is lower thanthe relative permittivity in the insulating portion 10 a. For example,the insulating portion 10 a includes silicon oxide. The insulatingportion 10 c includes insulating materials having lower relativepermittivity than the relative permittivity of silicon oxide, such assilicon oxide to which fluorine or carbon is added, and poly-arylene(PAr). The insulating portion 10 c may be porous in order to reduce therelative permittivity.

For example, in the process illustrated in FIG. 9A, the insulating layerIL1 is formed with the above-described material having low relativepermittivity. After formation of the conductive part 11 and the gateelectrode 12, the p-type base region 2, the n⁺-type source region 3, thep⁺-type contact region 5, the source electrode 22, and the like areformed without removing the insulating layer IL1. The remaininginsulating layer IL1 corresponds to the insulating portion 10 c.

According to the semiconductor device 170, the relative permittivity ofthe insulating part 10 can be reduced compared to the semiconductordevice 100. Thereby, the depletion layer easily extends in the n⁻-typedrift region 1 and the breakdown voltage of the semiconductor device 170is improved. Alternatively, the thickness of the insulating part 10between the n⁻-type drift region 1 and the conductive part 11 can bereduced while the breakdown voltage is maintained. For example, the sizeof the semiconductor device 170 can be reduced. Alternatively, thenumbers of the insulating part 10 and n⁻-type drift region 1 per unitarea are increased by a thickness corresponding to the reduction inthickness of the insulating part 10. Thus, the on-resistance of thesemiconductor device 170 can be reduced while increase in size of thesemiconductor device 170 is suppressed. Also, according to thesemiconductor device 170, the mechanical strength of the insulating part10 is improved compared to the semiconductor devices 150 and 160. Thiscan reduce a possibility that the semiconductor device 170 is damaged.

As a semiconductor device 180 illustrated in FIG. 14, the insulatingpart 10 may include the insulating portions 10 a to 10 c. The insulatingportion 10 b is provided along the drain electrode 21, the n⁺-type drainregion 4, and the n⁻-type drift region 1. The insulating portion 10 c isprovided between the insulating portion 10 b and the conductive part 11.The insulating portion 10 a is provided on the insulating portion 10 b,the insulating portion 10 c, and the conductive part 11.

According to the above modifications, the on-resistance of eachsemiconductor device can be reduced as in the embodiments. Further, thestructure according to each modification can be combined as appropriate.For example, in the semiconductor devices 110 to 130, the width of theconductive part 11 may vary in Z-direction as in the semiconductordevice 140. In the semiconductor devices 110 to 140, the insulating part10 may include the gap G as in the semiconductor device 150 or 160. Inthe semiconductor devices 110 to 140, the insulating part 10 may includethe insulating portion 10 c.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the invention.

What is claimed is:
 1. A semiconductor device comprising: a firstelectrode; a first semiconductor region of a first conductivity typeprovided on the first electrode and electrically connected to the firstelectrode; a second semiconductor region of a second conductive typeprovided on the first semiconductor region; a third semiconductor regionof the first conductive type provided on the second semiconductorregion; an insulating part provided on the first electrode and being indirect contact with the first electrode; a conductive part provided inthe insulating part and arranged in a second direction that crosses afirst direction directed from the first electrode to the firstsemiconductor region, with the first semiconductor region; a gateelectrode provided in the insulating part, the gate electrode beingpositioned above the conductive part and arranged in the seconddirection with the second semiconductor region; and a second electrodeprovided on the third semiconductor region and the insulating part, andelectrically connected to the third semiconductor region.
 2. The deviceaccording to claim 1, wherein a part of the insulating part is arrangedin the second direction with a part of the first electrode.
 3. Thedevice according to claim 1, wherein the first electrode includes afirst metal layer including a first metal that is at least one selectedfrom the group consisting of aluminum, nickel, copper, silver, vanadium,and chromium, and a first conductive layer provided between the firstmetal layer and the first semiconductor region and including a secondmetal that is at least one selected from the group consisting ofmolybdenum, tungsten, cobalt, nickel, tungsten, and aluminum; and thefirst metal is different from the second metal, or a composition of thefirst metal is different from a composition of the second metal.
 4. Thedevice according to claim 3, wherein at least a part of the firstconductive layer is arranged in the second direction with a part of theinsulating part.
 5. The device according to claim 1, wherein a length ofa lower portion of the conductive part in the second direction isshorter than a length of an upper portion of the conductive part in thesecond direction.
 6. The device according to claim 1, wherein theconductive part is electrically connected to the second electrode. 7.The device according to claim 1, wherein the second electrode includes asecond metal layer including a third metal that is at least one selectedfrom the group consisting of aluminum, nickel, copper, silver, vanadium,and chromium, and a second conductive layer provided between the thirdsemiconductor region and the second metal layer and including a fourthmetal that is at least one selected from the group consisting ofmolybdenum, tungsten, cobalt, nickel, titanium, and aluminum; and thethird metal is different from the fourth metal, or a composition of thethird metal is different from a composition of the fourth metal.
 8. Thedevice according to claim 1, further comprising a fourth semiconductorregion of a first conductivity type provided between the first electrodeand the first semiconductor region, wherein a density of firstconductivity type impurity in the fourth semiconductor region is higherthan a density of first conductivity type impurity in the firstsemiconductor region.
 9. The device according to claim 1, wherein theinsulating part includes a gap provided between the first electrode andthe conductive part and between the first semiconductor region and theconductive part.